This was posted on 2023-05-03
There is a lot of information that is needed to get started. Here I have listed some videos that helped me when I got started.
If you are interested to learn more, please have a look at these links which includes some factory tours and different explanations on the semiconductor manufacturing process.
The playlist of 15 videos below provides some deep dive in to each aspect of Semiconductor manufacturing.
Mattson Technology, Inc. designs, manufactures, markets and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits. They are a key supplier of plasma and rapid thermal processing equipment to the global semiconductor industry. Their processing equipment utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits. Our equipment and technologies are used by leading memory, foundry and logic device manufacturers, worldwide. New innovations from Mattson Technology in Atomic Surface Engineering TM address the most critical 3D logic and memory manufacturing challenges
Majority of the semiconductor industry is governed by SEMI standards (Shop semi.org).
Some of the commonly referred SEMI standards for equipment manufacturing would be as follows.
UL is also a widely recognized standard specially for Electrical components which are govered by UL508A
Overview of GEM Standard Video Part 1 (cimetrix.com)

SECS Message Code Generation Tool (hume.com)

Primarily the substrate processed will be the wafer. However, the wafer can be receieved as a bare wafer on fitted on to a frame with a film or tape (called tape frame or film frame) for purposes of handling during dicing.
When it comes to silicon wafers, there are 3 major sizes of wafers currently being used in industry as of 2023.
The next thing to keep in mind about silicon wafers is that they come with either a notch or a flat side for the purposes of orienting the wafer.
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For wafers which have a flat side, based on different surface treatment, but this is not always used.
In terms of tape frame / film frame there are a few standard sizes based on the wafer size which can be seen below
Having worked in a number of industries before, one of the most disorienting things at the start of your career can be all the abbriviations that get thrown around and everyone in the room uses them like they are standard words in the English vocabulary. These are some of the common abbrivations that I have come across.
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AMC |
Airborne Molecular Contamination |
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API |
Application Program Interface |
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APR |
Automatic Pressure Regulator |
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AWH |
Auto Wafer Hander |
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BLDC |
Brushless DC |
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BTP |
Built to Print |
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C2W |
Chip to Wafer |
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CDA |
Compressed Dry Air |
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CIM |
Computer-Integrated Manufacturing |
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CM |
Control Module |
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CR |
Carriage Return |
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EE |
End Effector |
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EFEM |
Equipment Front End Module |
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EMO |
Emergency Machine Off |
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EtherCAT |
Ethernet for Control Automation Technology |
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FAT |
Factory Acceptance Test |
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FFU |
Fan Filter Unit |
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FI |
Factory Interface (EFEM) |
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FOA |
Fab Owners Alliance |
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FOSB |
Front Opening Shipping Box |
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GEM |
Generic Equipment Model |
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GUI |
Graphical User Interface |
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HSMS |
High-Speed SECS Message Services |
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I/O |
Input Output |
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ICU |
Inductive Control Unit |
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IETF |
Internet Engineering Task Force |
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IPC |
Industrial PC |
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LCU |
Local Control Unit |
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LF |
Line Feed |
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LL |
Load Lock |
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LOTO |
Lockout Tagout |
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LP |
Load Port |
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LPM |
Load Port Module |
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LV32 |
Local Viewer 32 |
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MES |
Manufacturing execution system |
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MFC |
Mass Flow Controller |
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MPDU |
Main Power Distribution Unit |
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MPPS |
Most Penetrating Particle Size |
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MSIG |
MEMS & Sensors Industry Group |
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OCR |
Optical Character Recognition |
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OEM |
Original Equipment Manufacturer |
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OHT |
Overhead Track |
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PCW |
Process Cooling Water |
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PLP |
Panel Level Packaging |
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PM |
Process Module |
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PR |
Pressure Switch/ Pressure Regulator |
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PT |
Pressure Switch/ Pressure Transducer |
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PV |
Pressure Valve |
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RFID |
Radio Frequency Identification |
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RIM |
Remote Interface Module |
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RPM |
Rotation Per Minute |
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SECS |
SEMI Equipment Communications Standard |
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SSPS |
Site & System Preparation Specification |
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TCB |
Thermo Compression Bonding |
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TCP |
Transmission Control Protocol |
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UI |
User Interface |
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ULPA |
Ultra Low Particulate Air |
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WLP |
Wafer-level packaging |
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WPF |
Windows Presentation Foundation |
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